UV Laser Marking Machine.

  1. Floor standing model/Desktop split model/Flying model with 1.2m pillar
  2.  355nmUV air or water cooling Laser generator
  3. Sino Galvo SG7110 or Ouya M130 scanner
  4. Singapore Opex brand Lens
  5. Taiwan Meanwell power supply
  6. S&A Water chiller CWUL-05 (3W air cooling generator no chiller)

Feature of UV laser marking machine:

UV laser is cold light source . UV laser with short wavelength , focus , smaller spot , belongs to cold process with a little heat affecting , good beam quality , it can achieve perfect marking . Most materials can absorb ultraviolet laser , it is widely applied on industrial ; with very little heat affecting area , it won't have heat effect , there is no burning problem , pollution-free , non-toxic , high marking speed , high efficiency , the machine performance is stable, low power consumption.

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Video introduction

Tech Specifications

Laser Type UV Laser Marking Machine
Working area 110*110/200*200/300*300(mm)
Laser power 3W/5W/10W/15W(Optional)
Laser wavelength 355nm
Laser generator brand 3W Inggu air cooling,5W Huaray water cooling,10W  15W USA AOC water cooling
Application Metal and nonmetal
Marking Speed 7000mm/second
Indicate light Double red light
Repeated Precision ±0.003mm
Marking line width 0.01mm
Working voltage 110V~220V /50~60HZ
Cooling Mode Water Cooling
Supported graphic formats AI,BMP,DST,DWG,DXF,DXP,LAS,PLT
Support operation system Win7/8/10 system
Controlling software EZCAD
Goggles,foot switch,Ruler ,Udisk, data cable and other fix tools
Optional parts Rotary Device, Lift platform, other customized Automation
Package Wooden package



UV laser marking machine industry application:
1.355nm ultraviolet light focusing spot is very small, which greatly reduces the mechanical deformation of the material (cold light), because it is mainly used for ultra-fine marking and engraving, especially suitable for food, pharmaceutical packaging materials marking, micro-holes, glass High-speed division of materials and complex pattern cutting of silicon wafers and other application industries.

2. Mainly used in the high-end market of ultra-fine processing, marking the surface of packaging bottles of medicine, cosmetics, video and other polymer materials, the effect is very fine, the marking is firm and clean, better than ink coding and pollution-free; flexible pcb board marking Marking, dicing; silicon wafer micro-hole and blind-hole processing; LCD liquid crystal glass two-dimensional code marking, glassware surface drilling, metal surface coating marking, plastic buttons, electronic components, gifts, communication equipment, building materials

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